99% alumina ceramic substrates exhibit high resistivity insulation, superior thermal conductivity compared to 95% alumina, excellent high-temperature dimensional stability, high mechanical strength, a low coefficient of thermal expansion, surface metallizability, and corrosion resistance, making them well suited for high‑temperature, high‑power electronic applications such as power semiconductors and high‑power LEDs.

99 Porcelain Ceramic Substrate

Product Overview

The 99 porcelain ceramic substrate is a high-performance electronic packaging substrate manufactured from high-purity alumina ceramic raw materials. Compared to conventional 95 porcelain ceramic substrates, it offers superior thermal conductivity as well as enhanced electrical and mechanical properties. Leveraging the characteristics of its high-purity raw materials, this product achieves exceptionally high electrical insulation resistivity, outstanding heat dissipation capabilities, excellent resistance to high temperatures and deformation, high mechanical support strength, superior thermal stability, surface metallization compatibility, and resistance to acid and alkali corrosion. It provides stable insulating support, effective heat dissipation pathways, and a reliable circuit-carrying foundation for various high-power electronic components operating under high-temperature conditions, making it a core packaging material in fields such as power semiconductors, high-power LEDs, and industrial control equipment.

Key Features

1. Excellent electrical insulation performance: With extremely high resistivity, it effectively isolates current flow between different circuits, preventing leakage and short-circuit failures, while also reliably supporting diverse circuit routing requirements, providing a dependable foundation for electrical isolation in electronic devices.
2. Outstanding high thermal conductivity: Compared to standard 95 porcelain ceramic substrates, the 99 porcelain ceramic substrate exhibits superior thermal conductivity, rapidly dissipating heat generated during chip and power device operation, thereby reducing device operating temperatures and mitigating performance degradation or shortened lifespans caused by overheating.
3. Stable high-temperature performance: It remains undeformed and does not soften under high-temperature conditions, meeting the demands of long-term operation of high-power devices in elevated temperature environments without structural failure due to rising temperatures.
4. Superior mechanical strength: Featuring high hardness and flexural strength, it resists deformation, serving as a stable support platform for chips and power devices, providing reliable physical support and preventing component damage caused by mechanical stress.
5. Excellent thermal stability: With a low coefficient of thermal expansion, it minimizes cracking under alternating hot-and-cold conditions, adapting well to scenarios with frequent temperature fluctuations and ensuring structural integrity over prolonged use.
6. Surface metallizability: The substrate can undergo copper plating, silver plating, and other metallization processes, enabling direct wiring for thick-film and thin-film circuits without requiring additional insulating layers, thus simplifying the circuit fabrication process.
7. Superior corrosion resistance: Resistant to both acids and alkalis, it avoids oxidation reactions, maintaining stable performance even under long-term service conditions, making it suitable for complex operating environments and extending the substrate’s service life.

Core Advantages

1. High insulation and reliability: Its extremely high resistivity effectively prevents leakage and short-circuit faults, providing dependable electrical isolation for high-power circuits, reducing safety risks during device operation, and enhancing overall system stability.
2. Improved heat dissipation efficiency: With better thermal conductivity than 95 porcelain substrates, it swiftly removes heat generated by power devices, lowers junction temperatures, extends the service life of power semiconductors, high-power LEDs, and similar components, and boosts the long-term reliability of equipment.
3. Strong wide-temperature adaptability: Its resistance to high temperatures without deformation and low thermal expansion coefficient allows it to handle both the high-temperature operating conditions of high-power devices and the shock of alternating hot-and-cold environments, avoiding circuit failures caused by cracking or deformation.
4. Good processing compatibility: Its surface metallizability supports direct fabrication of thick-film and thin-film circuits, enabling copper or silver plating according to circuit needs, streamlining the circuit preparation process and reducing overall manufacturing complexity.
5. High long-term stability: With acid-alkali resistance and non-oxidizing properties, it maintains consistent performance in challenging environments, lowering subsequent maintenance costs and prolonging the equipment’s service life.

Core Product Value

1. Enhanced heat dissipation performance, effectively extending the lifespan of power devices and improving the long-term operational reliability of equipment.
2. A highly insulated and structurally stable design that reduces the risk of leakage and short circuits, boosting overall system safety.
3. Direct metallization capability, simplifying circuit fabrication and reducing production and maintenance costs for entire systems.
4. Broad temperature adaptability, capable of meeting the demanding conditions of new energy and industrial control applications, helping expand market reach.

Application Scenarios

This product is primarily designed to meet the packaging needs of various high-power, high-temperature electronic devices. Key application areas include: packaging of power semiconductor devices, encapsulation of high-power LED beads, packaging of diverse sensors, mounting of precision resistors, fabrication of thick-film circuits, providing insulating support and heat dissipation solutions for various electronic modules, and extensive use in new energy equipment, industrial control devices, and other sectors where substrate insulation, heat dissipation, and stability are critical. With its exceptional comprehensive performance, the 99 porcelain ceramic substrate delivers reliable insulating support, efficient heat dissipation channels, and robust circuit-carrying foundations for electronic components in these fields, ensuring stable operation under complex conditions involving high power, high temperatures, and fluctuating thermal environments.

Target Customer Groups

Power semiconductor manufacturers, high-power LED packaging companies, sensor R&D and manufacturing enterprises, thick-film circuit producers, electronic module integration service providers, new energy equipment manufacturers, industrial control equipment producers, cross-border electronic component suppliers, and electronic packaging material R&D and supply companies, among others.

Solving Industry Pain Points

1. Addressing the issue of insufficient thermal conductivity in conventional ceramic substrates, which leads to poor heat dissipation, excessive junction temperatures, and shortened lifespans of power devices. Compared to 95 porcelain substrates, the superior thermal conductivity of 99 porcelain substrates significantly enhances heat dissipation efficiency and lowers device operating temperatures.
2. Tackling the problem of inadequate high-temperature resistance in ordinary insulating substrates, which tend to deform or soften under high heat, rendering them unsuitable for high-power devices operating in extreme conditions. The 99 porcelain ceramic substrate maintains structural stability at elevated temperatures, making it ideal for long-term use in high-temperature environments.
3. Mitigating the challenge of high thermal expansion coefficients in standard substrates, which often result in cracking and failure under alternating hot-and-cold conditions. The low thermal expansion coefficient of the 99 porcelain ceramic substrate improves its ability to adapt to temperature fluctuations, reducing equipment malfunctions caused by environmental changes.
4. Overcoming the limitation of some substrates being unable to undergo direct metallization, leading to complicated and costly circuit fabrication processes. The surface metallizability of the 99 porcelain ceramic substrate enables direct fabrication of thick-film and thin-film circuits, simplifying production workflows and lowering overall manufacturing costs.
5. Solving the issue of poor corrosion resistance in conventional substrates, which easily oxidize and degrade quickly in complex environments. The acid-alkali resistance and non-oxidizing properties of the 99 porcelain ceramic substrate ensure long-term stable operation, reducing equipment maintenance expenses.

Frequently Asked Questions (FAQ)

Q1: What are the key differences between the 99 porcelain ceramic substrate and the 95 porcelain ceramic substrate?
A: Compared to conventional 95 porcelain ceramic substrates, the 99 porcelain ceramic substrate boasts superior thermal conductivity, enabling faster removal of heat generated by power devices. Additionally, it excels in electrical insulation, mechanical strength, and thermal stability, making it better suited for demanding high-power, high-temperature operating conditions.
Q2: Can the 99 porcelain ceramic substrate be directly used for circuit wiring?
A: Yes, the 99 porcelain ceramic substrate supports surface metallization, allowing copper or silver plating on its surface to form metallic layers, facilitating direct wiring for thick-film and thin-film circuits without requiring additional insulating layers.
Q3: Is the 99 porcelain ceramic substrate compatible with the operational requirements of new energy equipment?
A: Yes, the 99 porcelain ceramic substrate features high-temperature resistance, high thermal conductivity, excellent insulation, and strong thermal stability, making it well-suited to meet the high-temperature, high-power demands of power devices in new energy applications, providing reliable insulating support and heat dissipation solutions.
Q4: Is the 99 porcelain ceramic substrate prone to cracking under alternating hot-and-cold conditions?
A: The 99 porcelain ceramic substrate has a low thermal expansion coefficient and excellent thermal stability, so it rarely cracks under alternating hot-and-cold conditions, adapting well to scenarios with frequent temperature fluctuations.